Fluxless Solder Ball Mount, Inspection, Repair & Reflow

Simplified work processes

Eliminate the use of flux and stencils, making processes simple and efficient.

Eliminate the need for cleaning equipment, resulting in no waste water discharge.

Novel SMB technology reduces stencil wear and maintenance needs.

Enhanced product performance

High-speed testing and dual-head repair.

Automatic feature calibration to adapt to diverse process requirements.

The all-in-one flux-free ball placement, reflow, inspection, and repair machine independently developed by Hermes-Epitek features a simplified ball placement process. It eliminates the need for flux and the corresponding stencils, as well as the equipment and chemicals required for flux cleaning. The machine provides customers with a cost-effective and eco-friendly solution suitable for advanced wafer packaging processes such as CoWoS, WLCSP, and Fan-Out.

Inquery Contact